Macro Placement in VLSI Design

Macro Placement in Floorplan



  • Minimize Interconnect Length: Shrink the gap of connected macros with standard cells to improve signal timing and minimize delay.
  • Optimize Performance: Place macros to satisfy timing requirements and enhance the general chip performance.
  • Reduce Routing Congestion: However, do not use placement strategies that result in dense routing regions in the FPGAs since they will cause signal integrity problems and complicate the manufacturing process.
  • Enhance Power Distribution: Also, ensure that the placement of macros complements its power distribution and architecture aspect in minimizing IR drop.


Guidelines for Macro Placement

Minimize Interconnect Length
Place Near Core Boundary 
  • Calculate Channel Width: Calculate the number of signal connections and the routing layers to identify the minimum distance between macros needed, according to the DRC.
  • Define Keep-out Zones: Set buffer zones around macros that nothing other than standard cells or other components of the design can occupy to reduce densities and hence improve QoR.

  • Thermal-aware Placement: Supply macros that produce a high amount of heat all across the surface of the chip to prevent any region from getting extremely hot, therefore preventing the formation of hot zones.
  • Critical Path Consideration: As for the macros, they should be placed on the critical path where timing requirements need to be fulfilled and where signal signals have to propagate.
  • Hierarchical Blocks: It is essential to split the design into successive blocks, which contain macros; it will help in the parallel work of the design and verification teams.
  • Placement Refinement: Thus, it is advisable to use such iterative refinement approaches to modify the macro placement according to the results of the timing analysis, power analysis, and the reports on the congestion of the routing channels.




















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